November 22, 2022

AMD Ryzen 7000 ‘Raphael’ 5nm Zen 4 Chiplet Layout suggests up to 16 cores per die with 64MB L3 cache moved to vertical stacks

Just hours before AMD’s keynote at CES 2022, we received an interesting picture of what is rumored to be the chip layout of the next-gen Zen 4 cores powering the Ryzen 7000 ‘Raphael’ desktop processors.

AMD Ryzen 7000 “Raphael” processors will feature a mix of “priority” and “low TDP” Zen 4 cores: up to 16 cores per die with a vertically stacked L3 cache

Rumored to the chip layout, it looks like AMD will indeed offer a higher core count in the next iteration of Zen. The 5nm Zen 4 core will power the next-generation AMD Ryzen 7000 “Raphael”, Ryzen 7000 “Phoenix” and EPYC 7004 “Genoa” processors. This chip architecture is specific to the Ryzen Desktop family codenamed Raphael which will launch on the AM5 platform later this year and we expect AMD to reveal some details during its CES keynote as they release it. have done with the EPYC range, unveiling not only the V-Cache Parts ‘Milan-X’ but also Genoa and Bergamo based on the Zen 4 architecture.

Another AMD EPYC Genoa ‘Zen 4’ processor leaks, this time a 16-core chip with 2 active CCDs

To go into detail, the rumor that the chip layout suggests that AMD will have 16 Zen 4 cores on their Raphael chips, but 8 of those cores will be “priority” cores and will run in full TDP mode while the rest of the cores will be “priority” cores. 8 Zen 4 cores will be optimized low TDP cores and will run at a combined 30W TDP. Remember, Zen 4 Ryzen processors are expected to have up to 170W of TDP. Each Zen 4 “LTDP” and “Priority” core will have a shared 1MB L2 cache, but it looks like the V-Cache is completely gone and will be stacked vertically with each stack having 64MB of L3 cache. If AMD used two Zen 4 matrices on the Ryzen 7000 processors, that would give us 128MB of L3 cache.

It is also mentioned that the new architectural layout would not require any planning updates in the software, as was the case with the Intel Alder Lake processors which used a whole new hybrid approach. These “LTDP” backup cores would only be used once the primary cores hit 100% utilization and seem like an efficient way to get things going instead of just 16 full Zen 4 cores running at a higher TDP. .

It is also said that the V-Cache stacks will reside on top of the backup cores and that the first iteration of this design would only be limited to the L3 share between the priority cores. Rumors also claim that all 32-core AMD Ryzen 7000 ‘Raphael’ processors will feature 170W TDP and performance-wise a single 8-core ‘LTDP’ Zen 4 stack with 30W TDP. will offer faster performance than the AMD Ryzen 7 5800X (105W TDP).

Here’s everything we know about AMD’s Raphael Ryzen ‘Zen 4’ desktop processors

The next-generation Zen 4-based Ryzen Desktop processors will be codenamed Raphael and replace the Zen 3-based Ryzen 5000 Desktop processors codenamed Vermeer. Based on information currently available, Raphael processors will be based on the 5nm Zen 4 base architecture and will include 6nm I / O arrays in a chip design. AMD has suggested increasing the core count for its next-gen consumer desktop processors, so we can expect a slight increase from the current maximum of 16 cores and 32 threads.

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The brand new Zen 4 architecture is said to offer up to 25% IPC gain over Zen 3 and achieve clock speeds of around 5 GHz. AMD’s upcoming Ryzen 3D V-Cache chips based on the Zen 3 architecture will feature stacked chips so the design is expected to carry over to AMD’s Zen 4 chip line as well.

AMD Ryzen ‘Zen 4’ Desktop Processor Expected Features:

  • New Zen 4 processor cores (IPC / architectural improvements)
  • All New 5nm TSMC Process Node with 6nm IOD
  • Supported on AM5 platform with LGA1718 socket
  • Dual channel DDR5 memory support
  • 28 PCIe lanes (CPU exclusive)
  • 105-120W TDP (upper limit range ~ 170W)

As for the platform itself, AM5 motherboards will come with the LGA1718 socket which will last for quite some time. The platform will include DDR5-5200 memory, 28 PCIe lanes, more NVMe 4.0 and USB 3.2 I / O, and may also come with native support for USB 4.0. There will initially be at least two 600 series chipsets for AM5, flagship X670 and mainstream B650. X670 chipset motherboards are expected to support both PCIe Gen 5 and DDR5 memory, but due to an increase in size, ITX boards are reported to only feature B650 chipsets.

Raphael Ryzen Desktop processors are also expected to feature RDNA 2 integrated graphics, meaning that just like Intel’s consumer desktop line, AMD’s consumer line will also include support for iGPU graphics. As for the number of GPU cores there will be on the new chips, rumors say it goes from 2 to 4 (128-256 cores). This will be less than the number of RDNA 2 CUs featured on the soon-to-be-released Ryzen 6000 “Rembrandt” APUs, but enough to keep Intel’s Iris Xe iGPUs at bay.

The Zen 4-based Raphael Ryzen processors aren’t expected until late 2022, so there’s still plenty of time to launch. The line will compete with Intel’s 13th generation Raptor Lake desktop processor line.

AMD Consumer Desktop Processor Generations Comparison:

AMD processor family Code name Processor process Core / Thread Processors (Max) TDP Platform Platform chipset Memory support PCIe support To throw
Ryzen 1000 Summit ridge 14 nm (Zen 1) 8/16 95W AM4 300-Series DDR4-2677 Generation 3.0 2017
Ryzen 2000 Pinnacle Ridge 12 nm (Zen +) 8/16 105W AM4 400 series DDR4-2933 Generation 3.0 2018
Ryzen 3000 Matisse 7 nm (Zen 2) 16/32 105W AM4 500 series DDR4-3200 Generation 4.0 2019
Ryzen 5000 Vermeer 7 nm (Zen 3) 16/32 105W AM4 500 series DDR4-3200 Generation 4.0 2020
Ryzen 6000 Warhol? 7 nm (Zen 3D) 16/32 105W AM4 500 series DDR4-3200 Generation 4.0 2022
Ryzen 7000 Raphael 5 nm (Zen 4) 16/32? 105-170W AM5 600 series DDR5-4800 Generation 5.0 2022
Ryzen 8000 Granite ridge 3 nm (Zen 5)? to be determined to be determined AM5 700 series? DDR5-5000? Generation 5.0 2023

What are you most excited to see in AMD’s next-gen Zen 4 Ryzen desktop processors?

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